Aluminum base pcb Performance - Shenzhen Hongyunlai Electronic Technology CO.,LTD

Item	Test condition	Unit	Index
Item	Test condition	Unit	HYL-001	HYL-002	HYL-003
Thermal Conductivity	A	W/m.k	2.5 - 5.0	1.5 - 2.0	1.5 - 2.0
Peel Strength	A （After thermal stress)	N/mm	1.3 1.3	1.3 1.3	1.3 1.3
Thermal stress	288℃ No-separation No- bubbles	S	120S	120S	600S
Surface Resistivity	C-96/35/90 E-24/125	ΜΩ	107 105	107 105	107 105
Volume Resistivity	C-96/35/90 E-24/125	ΜΩ-mm	107 105	107 105	107 105
Electrical strength	A	KV/mm	30	30	30
Flammability	UL94	_ _	V- 0	V- 0	V- 0
Tg	A	℃	100	170	170
Moisture absorption	D- 24/23	%	0.03	0.03	0.03
CTI	TEC60112	V	600	600	600
Breakdown voltage	A	_ _	4KV(AC)	5KV(AC)	6KV(AC)